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Common Mistakes of BGA Rework
1- Excessive solder joint: Excessive use of solder paste usually causes a 25% return. 2- Pad damage while removing IC: Repairing damaged pads of a BGA chip is almost impossible and yo [...]
What’s BGA?
BGA is acronym of Ball Grid Array, this type of IC is very popular because of its small size. In fact, with this type of configuration, many pins can be embedded in a confined space. [...]
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