BGA is acronym of Ball Grid Array, this type of IC is very popular because of its small size. In fact, with this type of configuration, many pins can be embedded in a confined space.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
Limited space and a large number of pins are suitable for processors and systems on chips, as these ICs have multiple tasks as well as extensive communication with other system components.
But this kind of IC (BGA) is the problem with having the same access to the bases and eventually replacing or troubleshooting these types of ICs.
BGA Types
This type of IC has subsets to the following branches.
1- MAPBGA: Molded Array Process Ball Grid Array
2- PBGA: Plastic Ball Grid Array
3- TEPBGA: Thermally Enhanced Plastic Ball Grid Array
4- TBGA: Tape Ball Grid Array
5- MicroBGA
